Here Advanced Processing Equipment Technology  realizes your dream of flawless surface free from watermarks and particles. Advanced Processing Equipment Technology  has been preparing for the 300mm, under 0.13 technology’s surface to be even more perfect. The most adequate usage of Le Chatellier’s principle during the rinsing and drying procedure enables the finest control of
wafer surface as no system could have done before. Currently, APET’s NEO-series rinse & dry systems are showing the state-of-art performances in world-major DRAM mass production lines, including 200mm & 300mm wafer handling fabrications.

Application	RD	FRD	FRD OX	Remarks
	Rinse+Dry	DHF+Rinse+Dry	DIW/ Ozone+DHF+
Wafer size			Rinse+Dry
4" (100 mm)	NEO-RD 1000	NEO-FRD 1000	-
5" (125 mm)	NEO-RD 1250	NEO-FRD 1250	-
6" (150 mm)	NEO-RD 1500	NEO-FRD 1500	-
8" (200 mm)	NEO-RD 2000	NEO-FRD 2000	-
12" (300 mm)	NEO-RD 3000	NEO-FRD 3000	NEO-OX 3000

NEO-Series is the Cleaning & Drying system applicable both for the 200mm & 300mm process, intending towards the high-device production.
By understanding the customers' needs exactly along with the fast technology development,
NEO-Series understands the problems which the existing cleaning & drying systems has not been able to solve until now, as well as the little troubles that even the customers did not recognize yet.
Through introducing the innovative, even adventurous various new concepts and through the computer simulation from the design step, the optimized NEO-2000 Series has been embodied.

NEO-Series shows the ideal cleaning & drying performance not leaving any critical defect such as particles and watermarks even in the process under the 0.13um.
G-plate, the showerhead sliding onto the bath during the process and supplying the chemical and DIW densely into the bath, creates the best uniformity, and basically block the particle and SiO2 creation.
MT Chamber, the Multi-Tasking Chamber, accomplishing as the chemical distributor and Wafer Carrier, minimizes the process cycle which enables the higher throughput, and the optimized drying process condition.
In-Situ DHF Supplying system controls the temperature very stably and the density.